Suzhou Kaifa New Material Technology Co., Ltd.
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Aluminum nitride ceramics
Ceramic material: aluminum nitride
Processing accuracy: ± 0.001mm
Product Features:. Good electrical insulation
Provide color:
Custom processing: can provide drawings and sample processing customization
Email:beikenano@gmail.com
Email:beikenano@gmail.com
AIN crystal takes [AIN4] tetrahedron as the structural unit covalent bond compound, has wurtzite type structure, and belongs to hexagonal crystal system. Chemical composition AI 65.81%, N 34.19%, specific gravity 3.261g / cm3, white or off-white, single crystal colorless and transparent, sublimation decomposition temperature under normal pressure is 2450 ℃. It is a high temperature and heat resistant material. Coefficient of thermal expansion (4.0-6.0) X10-6 / ℃. The thermal conductivity of polycrystalline AIN is 260W / (m.k), which is 5-8 times higher than that of alumina, so it has good thermal shock resistance and can withstand extreme heat of 2200 ℃. In addition, aluminum nitride has the characteristics of not being attacked by aluminum liquid and other molten metals and gallium arsenide, and particularly has excellent corrosion resistance to molten aluminum liquid.
Performance
(1) High thermal conductivity (about 320W / m · K), close to BeO and SiC, more than 5 times that of Al2O3;
(2) The coefficient of thermal expansion (4.5 × 10-6 ° C) matches with Si (3.5-4 × 10-6 ° C) and GaAs (6 × 10-6 ° C);
(3) Various electrical properties (dielectric constant, dielectric loss, volume resistivity, dielectric strength) are excellent;
(4) Good mechanical properties, higher bending strength than Al2O3 and BeO ceramics, can be sintered at atmospheric pressure;
(5) Good optical transmission characteristics;
(6) Non-toxic.
application
1. Aluminum nitride powder has high purity, small particle size, and high activity. It is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrates.
2. Aluminum nitride ceramic substrate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss. It is an ideal large-scale integrated circuit heat dissipation substrate and packaging material.
3.Aluminum nitride has high hardness and surpasses traditional alumina.It is a new type of wear-resistant ceramic material, but due to its high cost, it can only be used in parts with severe wear.
4. Using AIN ceramics‘ heat resistance, melt erosion resistance and thermal shock resistance, GaAs crystal crucible, Al evaporating dish, magnetic fluid power generation device and high temperature turbine corrosion resistant parts can be made, and its optical properties can be used as infrared window. Aluminum nitride film can be made into high-frequency piezoelectric elements, ultra-large scale integrated circuit substrates, etc.
5. Aluminum nitride is heat-resistant and resistant to corrosion by molten metals, stable to acids, but easily eroded in alkaline solutions. The new surface of AIN will react with moist air to form a very thin oxide film. Using this feature, it can be used as a crucible for smelting metals such as aluminum, copper, silver, and lead, and as a mold material. AIN ceramics have good metallization properties and can replace toxic beryllium oxide ceramics and are widely used in the electronics industry.
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Quality AssuranceHigh standards of the industry-leading
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