use:
High-power power semiconductor module; semiconductor refrigerator, electronic heater; power control circuit, power hybrid circuit.
Intelligent power components; high frequency switching power supply, solid state relay.
Automotive electronics, aerospace and military electronic components.
Solar panel components; telecommunication switches, receiving systems; lasers and other industrial electronics.
Features:
Strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong binding force, anti-corrosion.
Excellent thermal cycling performance, the number of cycles reaches 50,000 times, and the reliability is high.
Similar to the PCB board (or IMS substrate), it can etch a variety of graphic structures; no pollution, no pollution.
The operating temperature is wide -55 ℃ ～ 850 ℃; the thermal expansion coefficient is close to silicon, which simplifies the production process of power modules.