Grinding Technology and Grinding Tools of Zirconia Ceramics
Zirconia ceramics have the characteristics of high hardness, high brittleness and low fracture toughness that are common to ceramic materials, which makes it easy for ceramic materials to produce deformed layers, surface/subsurface microcracks, material powdering, fuzzy surfaces, and phase change regions during processing. , residual stress and other defects limit the further expansion of the application range of ceramic materials.
1. Grinding technology in ductility domain
The ductile domain grinding technology is mainly aimed at brittle materials, and is committed to the pursuit of non-destructive grinding. When grinding brittle materials, the formation of chips is similar to that of grinding plastic materials such as metals. The "chips" are collectively removed by the abrasive in the form of shear, and there is no crack formation and brittleness on the surface and sub-surface after grinding. The uneven phenomenon during peeling avoids the occurrence of sub-surface cracks. It is a grinding method with minimal damage and has broad application prospects in the fields of ceramics, glass, optics and semiconductors.

2. Laser preheating assisted grinding
Zirconium oxide, silicon nitride, alumina and other engineering ceramic materials have high strength, wear resistance, and corrosion resistance. The post-processing of their products generally adopts grinding processing. The ordinary grinding processing technology has low production efficiency, high cost, and processing complex shapes. items are more difficult. The heat-assisted cutting technology that has appeared in recent years is an effective method to solve the processing of difficult-to-machine materials. At present, the commonly used heat sources are: plasma arc, oxyacetylene flame and laser, etc. Compared with other heat sources, the laser spot size is small, the energy density is high, and it has good controllability in energy distribution and time characteristics. Processing has been widely used.
3. ELID mirror grinding technology
Electrolytic in-process dressing (ELID) mirror grinding technology is a low-cost and high-efficiency ultra-precision mirror processing technology, which is widely used in ultra-precision processing such as engineering ceramics, cemented carbide, optical glass, glass ceramics, and single crystal silicon. in the field. For hard and brittle materials and difficult-to-machine materials, ELID mirror grinding technology, as an efficient mirror processing technology, will replace the traditional grinding and polishing process for precision mirror processing. Its working principle is shown in the figure below and the analysis below.
4. Ultrasonic grinding
Ultrasonic grinding mainly uses ultrasonic vibration tools to drive the abrasive suspension between the workpiece and the tool to impact and polish the workpiece, so that local materials are eroded to form powder to achieve perforation cutting and grinding, polishing purpose.
In the grinding process of ceramic materials, ordinary and ultrasonic-assisted grinding of zirconia ceramics is carried out through different grinding parameters. The research shows that during ordinary grinding, with the increase of grinding wheel speed, the grinding force of zirconia ceramics decreases significantly, while There is no obvious change in ultrasonic grinding; the depth of ultrasonic grinding can reach 10 μm, which is nearly 10 μm higher than that of ordinary grinding. Compared with EDM, electrolysis, and laser processing technology, ultrasonic grinding does not depend on the electrical conductivity of the material and has no thermophysical effect. It is especially suitable for the micro-processing of hard and brittle materials such as zirconia, and is developing towards high precision and miniaturization.